Ehrenfried Zschech Appointed as a Guest Chair Professor at Southeast University

Ehrenfried Zschech, a distinguished member of both the German National Academy of Sciences and Engineering and the European Academy of Sciences, has been appointed as a Guest Chair Professor at Southeast University. The appointment ceremony took place on October 8, 2024, and was attended by Huang Ru, an academician of the Chinese Academy of Sciences and the president of Southeast University.

During the ceremony, Vice President Sun Litao welcomed Professor Zschech and expressed gratitude for his contributions to the university. He highlighted that Professor Zschech’s presence will significantly enhance the academic capabilities of Southeast University in the field of integrated circuit manufacturing and packaging, thus bolstering the university’s reputation and influence in related fields globally.

Huang Ru awarded Professor Zschech with a visiting professorship certificate and a school souvenir, while Sun Litao presented him with the Southeast University emblem.

Professor Zschech is a world-renowned expert in integrated circuit manufacturing and analysis technology, particularly in X-ray non-destructive testing technology and equipment. He has received numerous accolades for his contributions to the field, including the European Materials Gold Award and the Pioneer Award from the German Materials Society. His extensive academic influence is reflected in his leadership roles within various organizations, including the European Materials Federation and the American Materials Society.

 

Following the appointment ceremony, Professor Zschech delivered a series of lectures and seminars to students and faculty at the Jiulonghu Campus and Wuxi Campus. His presentations included topics such as “Application of High-resolution X-ray Imaging in Materials Engineering and Sustainable Energy Technology,” “Using In-situ Nano XCT Technology to Study the Stability of Chip Back-end Interconnection Structures,” and “Application of High-resolution X-ray Tomography Technology in Advanced Packaging Measurement and Defect Location.” In these lectures, he introduced the principles of X-ray microscopy and nano XCT, demonstrating the extensive applications of high-resolution imaging technology in materials engineering, sustainable energy, and integrated circuit manufacturing and packaging.

This series of lectures forms part of the Core Taihu Academic Lectures at the School of Integrated Circuits of Southeast University.

Source: School of Integrated Circuits, Southeast University
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Release Date: October 14, 2024